2025 Process Integration Engineer Co-op/Intern (Cambridge, MA)

About the position

Applied Materials is the global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips – the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world – like AI and IoT. If you want to work beyond the cutting-edge, continuously pushing the boundaries of science and engineering to make possible the next generations of technology, join us to Make Possible® a Better Future. Applied Materials’ Integrated Materials Solution Group is searching for an intern to join our team in Spring 2025 for a minimum of 6 months. Our group explores and builds novel devices in the ICAPS (Internet of Things, Communications, Automotive, Power and Sensors) and Advanced wafer level heterogeneous integration technology sectors. Our opportunity will give you hands-on experience in semiconductor and advanced packaging process environments, and help you establish an understanding of the relationships between device design, material physics, process development, technology integration and functional characterization.

Responsibilities

• Assist with fabrication of proof-of-concept devices, which may include device layout, wafer processing, metrology and characterization, physical and electrical data analysis, and documentation.
• Lead small development projects involving wafer metrology, material characterization and data analysis.
• Support process integration engineering through procurement, shipping, and inventory functions.

Requirements

• Student must be pursuing a Bachelor’s, Master’s or PhD degree program in materials science, chemical engineering, electrical engineering, physics or chemistry, or related field.
• Student must be in good academic standing at their university, with a preferred GPA of 3.0 or above on a 4.0 scale.
• Experience in semiconductor processing or manufacturing preferred.
• A passionate drive, a curious mind and adaptable spirit are expected.
• Quick learner.

Benefits

• Compensation of $31 - $47 per hour based on location and education level.
• Hands-on experience in semiconductor and advanced packaging process environments.