About the position
Join Global Yield and experience the exciting transition of Intel technology development from Oregon to Intel High Volume Manufacturing Fabs. Global Yield is part of Fab Sort Manufacturing (FSM). FSM is responsible for the production of Intel silicon using the world's most advanced manufacturing processes in fabs in Europe and Ireland. As a key deliverable for IDM2.0 strategy, Global Yield was formed to drive continuous process technology development within FSM; in support of yield improvement, MOR changes, and Foundry Customer optimizations. This job is to seek BE (Backend) Process Integration Group Leader in FSM HVM Global Yield organization, reporting to the BE Process Integration Engineering Manager. The selected candidate will build and lead a team in HVM Global Yield organization and work with other leaders in the org, fab module/yield managers and TD leaders to support yield ramp-up and process optimization in early production stage, supporting internal and external customers.
Responsibilities
- Build and lead BEOL Integration team in FSM HVM Global Yield organization to execute HVM yield roadmap, device targeting and attain performance targets.
- Collaborate with BEOL Technology Development team to import new technology to production fabs across the globe.
- Work with Technology Program managers, FEOL Integration, Defect Reduction and Yield Analysis teams to identify root cause of yield/performance issues and propose mitigation plan in defined timeline to meet committed production yield/performance targets and to support fast paced yield ramp-up in high-volume manufacturing phases.
- Drive Back End process simplification to identify and implement cost reduction engineering opportunities.
- Support technical interactions with internal and external customers.
- Grow technical capability of the team.
Requirements
- Master's degree in Electrical Engineering, Physics or Materials Science major.
- 8+ years of experience in advanced node semiconductor industry in Cu BEOL Process Integration.
- 3+ years of people leadership experience to manage and direct an organization of 8+ process integration engineers in fast-paced high-volume semiconductor manufacturing environment.
Nice-to-haves
- Working knowledge in module processes including lithography, dry etch, wet etch, CMP, thin films and metrology.
- Ph.D. in Electrical Engineering, Physics or Materials Science major.
- Experience in serving external Foundry customers through technical interactions.
- Experience in new semiconductor technology development.
- Previous related work experience in a semiconductor foundry preferred.
Benefits
- Competitive pay
- Stock options
- Bonuses
- Health benefits
- Retirement plans
- Vacation
A Smarter and Faster Way to Build Your Resume