3D Heterogeneous Integration Development Engineer (Semiconductors)
Micross•Durham, NC
469d
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About The Position
The 3D Heterogeneous Integration Development Engineer will support the Micross 3D Heterogeneous Integration program by developing advanced semiconductor packaging processes and technologies. This role involves managing technology development projects, ensuring successful customer deliverables, and maintaining project schedules. The engineer will engage in various processes including TSV processing, wafer thinning, thermal compression bonding, and more, while also providing technical support for proposals and project management.
