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GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. The role is for a 3D Advanced Heterogeneous Integration Development Engineer which includes wafer to wafer hybrid bonding, die to wafer hybrid bonding, TSV/TOV and interposer development.
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