The Advanced Packaging Manager at IBM Research will lead chiplet and advanced packaging initiatives for IBM Semiconductors. This role requires strong leadership skills and a deep understanding of advanced packaging technologies, overseeing a multi-disciplinary team of engineers. The position involves collaboration with cross-functional teams and focuses on innovation in semiconductor packaging technologies.
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Job Type
Full-time
Career Level
Senior
Industry
Computer and Electronic Product Manufacturing
Education Level
Master's degree
Number of Employees
1,001-5,000 employees