Assembly Process Engineer

About the position

As a Microelectronic Assembly Process Engineer, you will have manufacturing responsibility for high volume manufacturing of Aerospace and Defense, Telecommunications and SATCOM devices. In that capacity, the ideal candidate would lead process development and sustaining activities involving semiconductor laser and silicon photonic chips. These include developing processes for mass manufacturing Optical devices and subsystems, utilizing Eutectic & Epoxy die attach, wirebonding and precision die placement. With at least three years of hands-on experience in assembly, integration and test of microelectronic devices, you'll work with other engineers to introduce/transfer (NPI) novel opto-electronics devices to precision large scale manufacturing. You will work closely with R D engineers to validate, test and qualify research and development prototypes in preparation for large scale manufacturing.

Responsibilities

• Extensive experience with Microelectronic device process development including Eutectic die attach, precision pick and place and wirebonding machines.
• Experience with automated precision-placement soldering and wirebonding of Semiconductor Lasers/Detectors and Photonic Integrated Chips.
• Working understanding of Opto-Electronic testing and characterization.
• Participates in the design and development of Microelectronic devices/subsystems.
• Participates/contributes/leads efforts to troubleshoot complex technical/engineering/quality and manufacturing issues.
• Plans/leads/executes DOEs aimed at resolving complex engineering/quality/manufacturing issues related to microelectronic process development.
• Lead process performance monitoring activities (SPC, Cp, and Cpk).
• Develops and introduces controlled inspection and test requirements into production plans.
• Develops and leads all Preventative Maintenance (PM) activities to ensure proper performance of all precision bonding and pick and place machinery.
• Leads all vendor technology integration efforts to address manufacturing issues and/or enhance precision and quality of the end manufactured devices/subsystems.

Requirements

• Minimum of a BS in Mechanical Engineering or any of the Physical Sciences.
• A minimum of 3 years relevant work experience in the microelectronics industry.
• Experience with optical subassembly processes, placement/alignment procedures and technology.
• Evidence of problem solving and a strong work ethic in a trusted team environment.
• Due to ITAR regulations, candidates must be a US person.