CMP Process Development Engineer - Packaging

Micron Technology - Boise, ID

Full-time - Mid Level

Boise, ID

Computer and Electronic Product Manufacturing

About the position

Micron Technology is seeking a CMP Process Development Engineer (Packaging) to join our R&D global headquarters in Boise, ID. This role is critical in developing CMP process technology that will enable the advancement of cutting-edge memory technology. As part of the advanced packaging team, you will be responsible for next-generation high bandwidth memory (HBM) pathfinding and development. Your primary focus will be on starting up, developing, and optimizing processes to enhance product quality and reliability. This includes working on process yield improvement, cost reduction, productivity enhancement, and risk management, as well as resolving manufacturing line issues. You will also coordinate and carry out evaluations and optimizations of processes, equipment, and materials to implement necessary changes at various process steps. In this role, you will drive design of experiments (DOEs) and analysis to create a process technology path towards defining leading HBM products in the market. Collaboration with cross-functional teams will be essential for the demonstration and development of advanced packaging technology. You will engage with external vendors and research partners to expedite the process development schedule. Additionally, you will employ model-based problem-solving techniques and drive innovation efforts through risk and issue mitigation, patents, and publications. Identifying, diagnosing, and resolving assembly process-related problems will be a key part of your responsibilities, along with leading continuous yield improvement and cost reduction activities. You will validate and fan out new process baseline qualifications, including new processes, tools, and materials for new product introductions, and support site-to-site process transfers.

Responsibilities

• Drive design of experiments (DOEs) and analysis to create a process technology path for leading HBM products.
• Collaborate with cross-functional teams for the demonstration and development of advanced packaging technology.
• Engage with external vendors and research partners to expedite the process development schedule.
• Utilize model-based problem solving and drive innovation efforts through risk mitigation, patents, and publications.
• Identify, diagnose, and resolve assembly process-related problems.
• Coordinate and execute process, equipment, and material evaluation/optimization initiatives and implement changes at process steps.
• Lead and participate in continuous yield improvement and cost reduction activities.
• Validate and fan out new process baseline qualifications, including new processes, tools, and materials for new product introduction.
• Support SPC/FDC/RMS/APC initiatives.
• Support site-to-site process transfers.

Requirements

• Master's Degree in Chemical Engineering, Mechanical Engineering, Industrial Engineering, Physics, Chemistry, or a related field (Ph.D. preferred).
• CMP process development and equipment-related experience required.
• Prior integration experience of 3D TSV, micro-bumps, temporary bonding/debonding, wafer thinning, BS TSV reveal, RDL, dicing, and hybrid bonding is preferred.
• Understanding of semiconductor devices, processes, and characterization techniques is preferred.
• Basic understanding of customer needs with a focus in the memory segment.
• Strong oral and written English communication skills.

Nice-to-haves

• Experience with advanced packaging technology development.
• Familiarity with risk management and innovation processes in semiconductor manufacturing.

Benefits

• Choice of medical, dental, and vision plans.
• Income protection programs for illness or injury.
• Paid family leave.
• Robust paid time-off program.
• Paid holidays.