Design Engineer- HBM Architecture- TPG

Micron Technology - Dallas, TX

Full-time - Mid Level

Dallas, TX

Computer and Electronic Product Manufacturing

About the position

As a Memory Design Engineer in the HBM organization at Micron Technology, you will be responsible for designing and analyzing digital and analog circuits for memory products. This role involves collaboration with various teams to optimize manufacturing functions and ensure high performance, power efficiency, and customer satisfaction. You will work on innovative memory solutions that integrate advanced technologies, contributing to the development of high bandwidth memory products essential for machine learning and artificial intelligence applications.

Responsibilities

• Contributing to the development of new HBM product opportunities by assisting with the overall design, layout, and optimization of Memory, Logic, and Analog circuits
• Parasitic modeling and assisting in design validation, reticle experiments and required tape-out revisions
• Overseeing and managing the layout process including floor-planning, placement, and routing
• Performing verification processes with modeling and simulation using industry standard simulators
• Maintaining technical expertise and provide training
• Contributing to cross group communication to work towards standardization and group success
• Working with Marketing, Probe, Assembly, Test, Process Integration, and Product Engineering groups to ensure proper manufacturability of product
• Proactively solicit input from Standards, CAD, modeling, and verification groups to ensure the design quality
• Driving innovation into the future Memory generations within a dynamic work environment
• Mentoring Junior members of staff

Requirements

• Extensive knowledge of CMOS Circuit Design and Device Physics
• Experience with power network analysis
• Extensive knowledge of Verilog modeling and simulation tools
• Extensive knowledge of state machine logic/design verification techniques
• Familiarity with memory design is required
• BSEE or greater
• 3+ years of relevant Engineering or Design Engineering experience

Nice-to-haves

• Good verbal and written communication skills with the ability to efficiently synthesize and convey sophisticated technical concepts to other partners and leadership
• Familiarity with schematic entry and simulation using Finesim and/or Hspice
• Proven track record of innovation and problem-solving in high-performance memory development
• A self-motivated, hard-working team player who enjoys working with diverse abilities and backgrounds
• Excellent problem-solving and analytical skills
• Having an innovative approach that is open to improving upon any of our processes or products.

Benefits

• Choice of medical, dental and vision plans
• Income protection programs for illness or injury
• Paid family leave
• Robust paid time-off program
• Paid holidays