Synopsys - Austin, TX
posted 2 months ago
At Synopsys, we are at the forefront of innovations that are transforming the way we work and play, including advancements in self-driving cars, artificial intelligence, the cloud, 5G, and the Internet of Things. Our System Solutions Group is dedicated to shaping dependable systems that prioritize safety, security, reliability, and low power consumption. We collaborate closely with customers and industry partners to understand their needs and identify the technical requirements necessary for their success. Our passion for methodologies and automation drives us to make our customers' jobs easier as they develop their products. We are currently seeking a Design Layout Engineer specializing in Advanced Packaging. This role is critical as it involves working on the rapidly growing area of advanced packaging and multi-die design implementation. Utilizing the industry's most advanced silicon design tools, you will provide comprehensive solutions that encompass architecture and design partitioning, floorplanning, routing, and simulation of advanced packaging designs. You will engage with various cross-functional teams to integrate multiple designs into a cohesive system, gaining expertise in chip-to-chip interfaces such as HBM3/4, UCIe, 3DIO, and high-speed IPs like PCIe and memory interfaces such as DDR5 and LPDDR. In this position, you will drive the progress of cutting-edge multi-die designs that power the most innovative GPUs and CPUs in the industry. You will also contribute to the latest technological advancements in multi-die packaging techniques such as CoWoS, InFO, and 3DIC. This role offers an exciting opportunity to be at the heart of technological innovation in the semiconductor industry.