Engineer - CMP/Bond Equip. Dev

Micron Technology - Boise, ID

Full-time - Mid Level

Boise, ID

Computer and Electronic Product Manufacturing

About the position

As an Equipment Development Engineer in the Wafer Bonding Tech Dev (TD) team at Micron Technology, you will play a crucial role in developing and optimizing next-generation wafer bond equipment. This includes first of a kind (FAOK) equipment such as bond, trim, grind, and others, aimed at enhancing capability, productivity, and cost-effectiveness. Your responsibilities will encompass the entire process from conception through equipment and sub-component development to implementation in both TD and manufacturing facilities. You will also be tasked with identifying, diagnosing, and resolving equipment-related issues using methodologies such as failure analysis, FMEA, 8D, or FDC/Data Science. In this position, you will coordinate and execute equipment evaluations and optimizations to implement necessary changes. You will lead and participate in initiatives aimed at improving equipment maturity and availability while also focusing on cost reduction activities. Collaboration will be key, as you will work closely with various teams including process development, manufacturing, and equipment vendors to ensure that robust processes meet the stringent physical requirements of Micron products. As you grow into an expert engineer, you will drive wafer bonding technology roadmaps that significantly influence Micron's global leadership in semiconductor manufacturing.

Responsibilities

• Develop strategies and execute to improve Equipment maturity for First of a Kind (FOAK) hardware.
• Develop hardware roadmaps for 5+ years in the area of wafer bonding (including bonding, trim, grinding).
• Develop dielectric and hybrid bonding equipment to meet the physical and electrical requirements of Micron's products.
• Optimize equipment to reduce cost, availability, and improve hardware and process capability.
• Collaborate with process development teams to develop innovative new solutions.
• Conduct root cause and failure mode analysis to understand the limitations of current hardware and drive Bond development projects with OEMs vendors for solutions.
• Perform fundamental research to drive innovative solutions for next-generation equipment products.
• Support equipment transfer to production facilities (some domestic or international travel may be required).

Requirements

• M.S./Ph.D. (or equivalent education) in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or other related technical fields.
• 2 or more years of semiconductor process or equipment engineering experience, preferably in wafer bonding and packaging field.
• Experience in dielectrics/hybrid bond equipment development with a fundamental understanding of bond process and equipment interactions.
• Experience in wafer bonding process development and understanding of bonding related inline/electrical/probe failure.
• Knowledge of semiconductor processing and solid-state device physics is desirable.
• Experience with design of experiment techniques (DOE), Statistical Process Control (SPC), defect analysis, and data analysis.
• Strong analytical and creative problem-solving skills.
• Ability to use extensive technical knowledge to guide strategic directions.
• Ability to resolve complex issues through root-cause or model-based problem solving.
• Proficiency in statistics, preferably in statistical process control.
• Ability to work independently, with minimal direction, and a focus on meeting commitments.
• Ability to multi-task and manage numerous projects simultaneously.
• Hands-on experience with wafer bonding tools and overlay systems.

Benefits

• Choice of medical, dental, and vision plans to meet family healthcare needs and budget.
• Income protection programs for illness or injury.
• Paid family leave.
• Robust paid time-off program and paid holidays.