Field Application Engineer - Flexible Printed Circuits

Molex - Naperville Park District, IL

Full-time - Mid Level

Remote - Naperville Park District, IL

Computer and Electronic Product Manufacturing

About the position

The Field Application Engineer for Flexible Printed Circuits at Molex will focus on developing solutions to meet customers' design needs for flexible printed circuits. This role involves providing technical guidance to customers and internal teams, ensuring optimal design and manufacturing processes, and leveraging Molex's capabilities to deliver innovative electronic solutions.

Responsibilities

• Work with the customer to gather Voice of the Customer (VOC) and other critical design requirements.
• Review customer design inputs: Schematics, Pinouts, Signal Integrity and Power requirements and determine if the requirements are able to meet the customer's design objective.
• Provide design guidance to CAD resources on optimal layout for each customer design, review and approve CAD outputs.
• Provide manufacturing guidance to Molex Taiwan design and process engineering teams to ensure NPI designs are manufactured correctly.
• Follow product development process, cooperate with cross functional team to support customer product design requirement.
• Perform signal integrity measurement or simulation to analyze and support external/internal customers.
• Review costings from Molex Taiwan for accuracy before submitting to BDM for quoting.

Requirements

• Bachelor's degree in Electrical Engineering
• 3 or more years of Signal and Power Integrity analysis or high-speed signal and power PCB/FPC design experience
• Experience laying out circuits with Allegro or Altium
• Experience with SI simulation software
• Ability to work with cross functional teams at customers and internally, with those teams spread out geographically around the world (primarily US, Asia, and Europe)
• Experience in creating and using FMEA's and performing DFM reviews
• Knowledge of materials and processes used in FPC fabrication
• Knowledge of IPC standards requirements and how those impact design and fabrication processes
• Knowledge of how to use lab equipment, multi-meter, spectrum analysis, oscilloscope etc.

Nice-to-haves

• 7 or more years of Signal and Power Integrity analysis or high-speed signal and power PCB/FPC design experience
• Experience with HFSS simulation software
• Experience with Siemens Teamcenter and Polarion
• Certified IPC designer, in depth knowledge of IPC 2222 requirements
• Experience with HFSS for SI analysis
• Knowledge of how circuit design impacts mechanical performance of FPC circuit
• Ability to design in additional functionality beyond just the circuit design.

Benefits

• Medical, dental, vision insurance
• Flexible spending and health savings accounts
• Life insurance
• Accidental death and dismemberment (ADD) insurance
• Disability insurance
• Retirement plan
• Paid vacation/time off
• Educational assistance
• Infertility assistance
• Paid parental leave
• Adoption assistance