Focal Plane Assembly Process Engineer

Raytheon Technologies - Santa Barbara, CA

Full-time - Mid Level

Santa Barbara, CA

Computer and Electronic Product Manufacturing

About the position

The Focal Plane Assembly Process Engineer at Raytheon is responsible for developing and optimizing manufacturing processes for focal plane arrays and flight-based vision systems. This role involves working closely with a diverse team in a semiconductor fabrication clean room, focusing on Flip Chip Bonding and other assembly technologies. The engineer will provide technical expertise, maintain and improve current processes, and troubleshoot equipment issues to enhance production efficiency and yield.

Responsibilities

• Support operational staff by providing technical expertise in Focal Plane fabrication.
• Work with a diverse team of technicians and engineers in a semiconductor fabrication clean room setting.
• Maintain current processes through standard statistical process control methods and optimize existing processes to improve yield and throughput.
• Train and support technicians in the safe and efficient use of processes.
• Take ownership and responsibility for the control, development, and optimization of Focal Plane fabrication.
• Troubleshoot and resolve processing or equipment issues to meet manufacturing process goals.
• Research new suppliers of equipment and technologies to improve production, quality, and throughput.
• Partner with systems engineering and other support teams to define and prove in new tooling and Focal Plane part designs.

Requirements

• Typically requires a degree in Science, Technology, Engineering, Mathematics, or a STEM degree in a related field and a minimum of 8 years' experience as a Process or Manufacturing Engineer in an Optics, Electro-Optics and/or Microelectronics environment, or an advanced degree with 5 years of experience.
• Ability to obtain and maintain a US Government issued clearance is required.
• U.S. Citizenship is required as only US citizens are eligible for a security clearance.

Nice-to-haves

• Experience with Flip Chip bonders (Hybridizers), epoxy dispense machines, Anti Reflective Coating tooling and/or chambers, interferometers and other support equipment required for Focal Plane assembly.
• Hands-on experience with FC-150 and FC-300 flip chip bonders; operation, programming and basic understanding of maintenance using Thermo compression and solder reflow processes, specifically with indium bump interconnects.
• Ability to solve technical problems, project ownership, meeting deadlines, and multitasking.
• Thorough sense of ownership, drive, and dedication to continuous improvement.
• Ability to work collaboratively with cross-functional teams to improve processes.
• Excellent verbal/written communication skills, including technical writing for summarizing data and findings, writing process and equipment specifications and work instructions.
• Detail-oriented with excellent organizational skills and project management experience.

Benefits

• Medical insurance
• Dental insurance
• Vision insurance
• Life insurance
• Short-term disability
• Long-term disability
• 401(k) match
• Flexible spending accounts
• Flexible work schedules
• Employee assistance program
• Employee Scholar Program
• Parental leave
• Paid time off
• Holidays