Raytheon Technologies - Tucson, AZ
posted 5 months ago
At Raytheon, we are committed to helping our nation and allies defend freedoms and deter aggression. The Product Design and Packaging (PDP) Team is seeking a Principal Electrical Engineer to join us as an Electrical Computer Aided Designer Engineer (ECAD). This role is pivotal in developing best-in-industry technologies that align product capabilities with customer needs. We empower our engineers to leverage design commonality and innovation, balancing risk and rigor to achieve predictable and affordable solutions. We are looking for candidates who are willing to collaborate, innovate, and work with our engineers to utilize cutting-edge technology. In this position, you will be responsible for the creation of PCB, Circuit Card Assembly (CCA), and Schematic drawings for suppliers. You will utilize software such as Siemens to design layouts that include Rigid, Flex, and Rigid-Flex assemblies. Your work will encompass full designs, re-spins, drawing updates, change notices, copper changes, and process improvement projects both within and outside your discipline. Daily interactions with various engineering levels and disciplines, including Electrical, Mechanical, Components, Test, and Producibility Engineering, will be essential to ensure that overall design requirements are captured while keeping cost, cycle time, and producibility in mind. To qualify for this role, you typically need a Bachelor's degree in Science, Technology, Engineering, or Mathematics (STEM) and a minimum of 8 years of relevant experience, or an Advanced Degree in a related field with a minimum of 6 years of experience. You should have experience with the electrical design process, including RF layout, and a history of laying out Rigid, Flex, or Rigid-Flex boards. A U.S. government-issued security clearance is required, and U.S. citizens are eligible for a security clearance. You will also need a working knowledge of Analog, Digital including DDR, RF, Power, and mixed technology, including multi-layer designs with High Density Interconnect (HDI) technology. Additionally, you should be familiar with exporting manufacturing data in both Gerber and ODB++ formats, and have awareness of Valor NPI, Design for Manufacturing rule sets, and other Design Rule Checking software. Knowledge of military and commercial design standards, GD&T techniques, and overall producibility considerations related to electronic packaging is also necessary. Effective communication skills are crucial, as you will need to communicate through various means including Telecoms, MS Teams, Zoom, and video conferencing. The ability to multi-task and demonstrate improvements in processes, systems, or products to enhance performance is essential. You should be proactive within your discipline and able to apply those qualities to other similar or complementary disciplines with minimal supervision. A working knowledge of operating system concepts and implementations, as well as network services related to Microsoft Windows suites, is also required. Willingness to work extended hours (nights and/or weekends) as required to complete assigned tasks is expected.