IC Packaging Integration Engineer

$138,900 - $256,500/Yr

Apple - Cupertino, CA

Full-time - Mid Level

Cupertino, CA

Computer and Electronic Product Manufacturing

About the position

As an IC Packaging Integration Engineer at Apple, you will be at the forefront of developing innovative semiconductor packaging solutions that enable groundbreaking technologies and products. This role requires a detail-oriented and passionate individual who thrives in a collaborative environment. You will work closely with cross-functional teams to lead the integration and architecture efforts for System on Chip (SoC) packages, ensuring that the packaging meets the high standards of performance, reliability, and cost-effectiveness that Apple is known for. Your responsibilities will include driving the development of advanced packaging solutions, exploring new material developments, and establishing specifications that align with industry standards. You will also be involved in the testing and failure analysis of packaging systems, ensuring that they meet the rigorous demands of Apple's product ecosystem. In this position, you will leverage your expertise in multi-functional packaging areas, including package layout and architecture, process technologies, thermal and mechanical considerations, and system-level reliability. Your strong problem-solving skills, grounded in physics and engineering fundamentals, will be essential as you tackle complex challenges in packaging design and integration. Excellent communication skills are crucial, as you will be collaborating with internal teams and overseas suppliers to ensure seamless integration of packaging solutions into Apple's product lines. This role offers a unique opportunity to contribute to the development of cutting-edge technologies that enhance user experiences across a wide range of Apple products.

Responsibilities

• Responsible for IC packaging development.
• Work with cross-functional teams to lead SoC Package integration and architecture efforts.
• Drive the industry with advanced package solutions and new material developments.
• Establish specifications for packaging solutions.

Requirements

• BS degree in a relevant field.
• 3+ years of experience in semiconductor packaging and/or system integration.
• Good understanding of multi-functional packaging areas including package layout, architecture, and enabling process technologies.
• Knowledge of advanced packaging technologies and high-density interconnects.
• Strong problem-solving skills with a solid foundation in physics and engineering fundamentals.
• Excellent communication skills for collaboration with internal teams and overseas suppliers.
• Basic knowledge of signal integrity/power integrity.

Benefits

• Comprehensive medical and dental coverage.
• Retirement benefits.
• Discounted products and free services.
• Reimbursement for certain educational expenses, including tuition.
• Discretionary bonuses or commission payments.
• Relocation assistance.