Apple - Santa Clara, CA
posted 4 months ago
As an IC Packaging Engineer at Apple, you will play a crucial role in the development of integrated circuit (IC) packaging. This position requires a detail-oriented and dedicated individual who is passionate about excellence and innovation. You will be responsible for leading the integration and architecture efforts of System on Chip (SoC) packages, collaborating with cross-functional teams to drive advancements in packaging solutions. Your work will involve the development of new materials and specifications that push the boundaries of current technology, ensuring that Apple remains at the forefront of the industry. In this role, you will engage in various aspects of IC packaging development, including the design and implementation of advanced packaging technologies. You will need to have a solid understanding of multi-functional packaging areas, which encompass package layout and architecture, enabling process technologies, and the reliability of materials and components at both the system and package levels. Your expertise will be essential in delivering high-density and high-performance interconnects while adhering to thermo-mechanical, reliability, and cost constraints. The ideal candidate will possess excellent problem-solving skills, a strong foundation in physics, and the ability to communicate effectively with internal teams and overseas suppliers. You will be expected to contribute to the continuous improvement of packaging processes and technologies, ensuring that Apple products meet the highest standards of quality and performance.