SkyWater Technology is seeking an Integrated Circuit (IC) Package Design and Layout Engineer for its Florida Advanced Packaging site. This role focuses on designing advanced packages using wafer-level technologies, collaborating with both external customer design teams and internal engineering teams to optimize designs for cost, manufacturability, performance, and reliability. The engineer will support initiatives in advanced assembly processes across various application areas, including Fan-Out Wafer Level Packaging (FOWLP) and interposers.
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Job Type
Full-time
Career Level
Mid Level
Industry
Computer and Electronic Product Manufacturing
Education Level
No Education Listed