Skywater Technology Foundry - Bloomington, MN
posted 19 days ago
Full-time - Mid Level
Bloomington, MN
Computer and Electronic Product Manufacturing
About the position
SkyWater Technology is seeking an Integrated Circuit (IC) Package Design and Layout Engineer for its Florida Advanced Packaging site. This role focuses on designing advanced packages using wafer-level technologies, collaborating with both external customer design teams and internal engineering teams to optimize designs for cost, manufacturability, performance, and reliability. The engineer will support initiatives in advanced assembly processes across various application areas, including Fan-Out Wafer Level Packaging (FOWLP) and interposers.
Responsibilities
- Design and layout of advanced 2.5D/3D packages based on FOWLP, interposer, and other advanced heterogeneous integration technologies.
- Work directly with customers to support PDK distribution, package layout, and design rule check/verification.
- Create and maintain design rules and design methodologies.
- Development and preparation of detailed drawings for customers, such as package outline drawings, and detailed drawings for IC packaging designs.
- Work with vendors to accept, manage, and modify PDKs (as needed) for our standard platform offerings.
- Train customers on use of PDKs for their own designs and provide customer support.
- Coordinate mask acquisition for fab photolithography tools as needed.
- Perform other duties as assigned.
Requirements
- Demonstrated experience in the design of advanced packages based on wafer level technologies.
- Experience with Fan-Out Wafer Level Packaging (FOWLP) and interposer technologies.
- Strong understanding of design rules and methodologies for IC packaging.
Nice-to-haves
- Experience in advanced assembly processes for multiple application areas.
- Familiarity with photolithography tools and mask acquisition.
Benefits
- Opportunities for professional development and growth.
- Collaborative work environment with a focus on innovation.
