IBM - Albany, NY

posted 14 days ago

Full-time
Albany, NY
Computer and Electronic Product Manufacturing

About the position

As a Hardware Developer at IBM, you will be part of a pioneering team focused on integrating advanced semiconductor technologies that drive the quantum revolution and AI era. This role involves working on the back end of the line (BEOL) silicon semiconductor processing and collaborating with cross-functional teams to develop next-generation semiconductor packaging technologies.

Responsibilities

  • Integrate processes spanning BEOL silicon semiconductor processing, wafer finishing, and grindside processing.
  • Develop 2.x and 3D silicon technologies and beyond.
  • Collaborate with cross-functional teams including engineers in unit process development, materials and process development, structural/chemical/electrical analysis, and layout design.

Requirements

  • Bachelor's degree in a science or engineering discipline.
  • Understanding of semiconductor fabrication processes and tools.
  • 3+ years hands-on experience in TSV process integration, hybrid bonding, temporary bonding-debonding, bumping, wafer level fan out, and semiconductor packaging technology.
  • 3+ years experience with interpreting failure analysis from structural and chemical characterization techniques.
  • 3+ years experience with design of experiments, process controls, and statistical data analysis.

Nice-to-haves

  • Doctorate Degree
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