Manager, Sustaining Engineering, Plating and Bond & Grind

About the position

This position is responsible for overseeing the Process and Equipment Engineering team supporting the electroless plating, wafer bonding, and wafer grinding modules. This person will sustain and develop processes and equipment to provide consistent device performance, yield, and quality. They will provide continuous improvement on cycle time, tool availability, and process/product yield, and will drive cost reductions in the etch module. They will also provide strategic guidance, coaching, and mentorship to their team and be highly involved in the continued staffing of the Mohawk Valley Fab.

Responsibilities

• Provide guidance and strategic direction to a team of 10+ engineers and technicians, while driving results in the module
• Analyze SPC/DOE data using sound statistical methodology to draw conclusions and make adjustments as needed
• Resolve process issues and continuously improve cycle time to achieve production targets
• Work cross-functionally with Operations, R&D, and New Product Introduction teams as we continue to ramp the Mohawk Valley Fab
• Own and facilitate efforts to drive best in class performance, yield, and quality; analyze and present relevant technical data to peers and senior leaders

Requirements

• Bachelors in Electrical Engineering, Chemical Engineering, Materials Science, or related field
• 3-5 years of experience directly managing an Engineering team in a semiconductor environment
• Experience with equipment and characterization on plating and bond/grind processes (such as electroless plating, wafer bonding and debonding, edge grinding, and wafer thinning)

Benefits

• Childcare assistance
• Paid parental leave
• Continuing education assistance