Celestial - Santa Clara, CA
posted 4 months ago
As a Principal Engineer in 2.5D/3D Process Development at Celestial AI, you will play a pivotal role in addressing the challenges posed by the increasing demands of AI workloads. The company is at the forefront of innovation, utilizing Photonic Fabric technology to tackle the 'Memory Wall' problem, which has been a significant bottleneck in data transfers between processors and memory. This technology enables an impressive memory capacity of tens of Terabytes at full HBM bandwidths, with low latency and power consumption. Your expertise will be crucial in driving the development of AI products from initial concept through to high-volume manufacturing, ensuring that the assembly process technology is robust and efficient. In this position, you will leverage your extensive experience in 2.5D assembly processes and partner management to collaborate closely with foundries and OSATs. Your responsibilities will include managing the assembly process technology development, focusing on design for manufacturing, reliability, and cost-effectiveness. You will be tasked with identifying and mitigating risks associated with new technologies used in product integration, ensuring that the factory is ready for production during the New Product Introduction (NPI) phase. This role demands hands-on experience in TSV and wafer process development, as well as strong project management skills, effective communication abilities, and a proactive approach to problem-solving. You will work with cross-functional packaging teams to lead the development of TSV and backend stack processes at the foundry, as well as 2.5D/3D CoW process development at OSATs. Your goal will be to bring innovative packaging solutions from concept to prototype and ultimately ramp them to high-volume manufacturing while implementing aggressive cost reduction strategies. Additionally, you will manage the qualification of packages, ensuring high thermo-mechanical reliability while adhering to established cost constraints. Your leadership will drive ideation and innovation in advanced packaging solutions, collaborating with vendors to enhance productization efforts at Celestial AI.