Principal Engineer - HBM Design | Architecture - TPG

$127,000 - $280,000/Yr

Micron Technology - Dallas, TX

Full-time - Senior

Dallas, TX

Computer and Electronic Product Manufacturing

About the position

As a Principal Engineer specializing in HBM Design at Micron Technology, you will lead the design and development of next-generation High Bandwidth Memory (HBM) DRAM products. This role involves collaborating with a multi-functional team of experts across various engineering domains to ensure the success of Micron's HBM roadmap. You will leverage your expertise in memory architectures, high-speed interface design, and custom circuit design to innovate and optimize product performance, power efficiency, and reliability.

Responsibilities

• Design and develop next-generation HBM DRAM products.
• Collaborate with Design Engineering, Product Engineering, Process Development, and Package Engineering teams.
• Analyze bottlenecks and propose innovative architectures for HBM products.
• Engage with customers to support current HBM architectures and identify opportunities for innovation.
• Debug and identify root causes for pre-silicon and post-silicon issues in HBM products.

Requirements

• Bachelor's degree in Electrical Engineering or related field.
• 7+ years of relevant job/skill-related experience.
• Familiarity with DRAM operation and JEDEC specifications, preferably with HBM products.
• Experience in digital (Verilog) and analog (FastSpice & Hspice) modeling and simulations.
• In-depth technical expertise in DRAM memory array design, high-speed clocking, and interface development.

Nice-to-haves

• Proven track record of innovation in high-performance memory development.
• Good verbal and written communication skills to convey technical concepts effectively.
• Self-motivated team player with an innovative approach to processes and products.

Benefits

• Dental insurance
• Family leave
• Health insurance
• Paid holidays
• Paid time off
• Vision insurance