Micron Technology - Boise, ID

posted 6 months ago

Full-time - Senior
Boise, ID
10,001+ employees
Computer and Electronic Product Manufacturing

About the position

As a Principal Engineer in the Advanced NAND research and development dry etch team at Micron Technology, you will play a pivotal role in leading the development of dry etch processes that are critical to the performance and reliability of NAND memory solutions. This position offers a unique opportunity to innovate and collaborate with various process integration teams, including Wet etch, CVD, Diffusion, Metals, Lithography, and CMP. You will be responsible for owning the process roadmap, ensuring that it aligns with program and yield goals, and working with state-of-the-art dry etch chambers. Your role will involve not only technical expertise but also leadership in guiding multi-functional teams to address complex structural challenges and drive towards collaborative solutions. In this position, you will be expected to produce and present comprehensive process and technology roadmaps for current and future technology nodes. You will also support root cause analysis and unique defect investigations, which may require travel for project-related purposes. As a senior member of the team, you will mentor peers in dry etch technology and project management, providing critical updates to upper management regarding project status and impacts. This role is designed for individuals who thrive in a research and development environment and are eager to contribute to the advancement of semiconductor technology.

Responsibilities

  • Leading Dry etch process development
  • Innovate/explore/develop dry etch processes to meet structural and electrical specifications
  • Work and innovate with process integration teams to influence integration flows and specs
  • Collaborate and lead multi-functional teams to solve complex structural problems
  • Support root cause and unique defect analysis
  • Produce and present process and technology roadmaps for current and future technology nodes
  • Identify and drive towards a collaborative solution with other process areas
  • Guide other area's technology roadmaps
  • Develop expertise in other areas of process hardware or technologies
  • Be a resource and mentor for peers in dry etch technology and/or project management
  • Provide critical updates to upper management on project status and impacts

Requirements

  • MS / PhD with 3-10 years of relevant experience
  • BS + 5-10 years of relevant experience
  • Experience with both ICP and CCP tools
  • Understanding of different types of dry etch reactors (e.g., RF sources, chemistries)
  • Knowledge of plasma physics, transport or surface phenomena gained through experience and/or coursework
  • Experience in managing vendor relationships and driving vendors for solutions
  • High aspect ratio etch experience (preferred)
  • Experience in running technical projects or leading groups of other engineers
  • Experience in or understanding of statistical process control and analysis
  • Proven leadership in problem-solving
  • Strong computer skills, including MS Office

Nice-to-haves

  • High aspect ratio etch experience (preferred)

Benefits

  • Choice of medical, dental and vision plans
  • Income protection programs for illness or injury
  • Paid family leave
  • Robust paid time-off program
  • Paid holidays
© 2024 Teal Labs, Inc
Privacy PolicyTerms of Service