Principal / Senior Principal Plasma Enhanced Chemical Vapor Deposition (PECVD) Semiconductor Process Engineer

$102,400 - $153,600/Yr

Northrop Grumman - Linthicum Heights, MD

Full-time - Mid Level

Linthicum Heights, MD

Computer and Electronic Product Manufacturing

About the position

The Plasma Enhanced Chemical Vapor Deposition (PECVD) Semiconductor Process Engineer at Northrop Grumman will be responsible for sustaining and developing PECVD processes for semiconductor products. This role involves working in a Class 100 cleanroom environment, interfacing with various engineering teams, and contributing to process improvement projects. The engineer will also be involved in training technicians and maintaining process documentation, supporting statistical process control, and engaging in continuous improvement efforts.

Responsibilities

• Sustain existing PECVD processes for a development line including process qualifications and technician training.
• Interface with other unit process engineers, operations, and integration engineers during the design and execution of process/equipment improvement projects.
• Develop PECVD processes for new materials and emerging technologies in microelectronics and superconducting electronics.
• Write and maintain process documentation.
• Support statistical process control (SPC) and continuous improvement efforts.
• Perform all other related duties as assigned.

Requirements

• Bachelor's degree in Electrical Engineering, Chemical Engineering, Materials Engineering, Chemistry, Physics, or related technical discipline with 5 years of relevant experience (3 years with a MS, 0 with a PhD) for Principal Engineer; 8 years of relevant experience (6 years with a MS and 3 with a PhD) for Senior Principal Engineer.
• PECVD industry experience.
• Hands-on experience running semiconductor process equipment and with process sustaining/development activities.
• Ability to work independently and provide technical solutions to complex problems.
• Ability to work a large percentage of time in a Class 100 cleanroom environment.
• Knowledge of statistical process control (SPC).
• Must be a US Citizen and able to obtain and maintain a Secret clearance.

Nice-to-haves

• Direct experience with semiconductor fabrication in a cleanroom environment.
• Hands-on experience with PECVD/Diffusion/Implant/RTP process equipment.
• Experience with TEOS- and silane-based dielectric deposition.
• Experience with thin film characterization equipment and techniques.
• Experience with PECVD, ALD, MOCVD, Diffusion, RTA/RTP, Implant.
• Excellent project management skills with the ability to identify manufacturing improvements and implement solutions.
• Experience in structured problem-solving methodology to troubleshoot tool and process issues.
• Data analysis and visualization skills (JMP and/or MiniTab).
• Advanced knowledge of statistical process control (SPC).
• Active Secret clearance.

Benefits

• Health insurance coverage
• Life and disability insurance
• Savings plan
• Company paid holidays
• Paid time off (PTO) for vacation and/or personal business