Northrop Grumman - Baltimore, MD

posted 2 months ago

Full-time - Mid Level
Baltimore, MD
Computer and Electronic Product Manufacturing

About the position

Northrop Grumman is seeking engineers with experience in electronic assembly and packaging design, specifically in RF/microwave and mixed signal assemblies and subsystems. The role involves designing, modeling, and verifying various RF/microwave components, collaborating with cross-functional teams, and supporting products throughout their life cycle. This position offers the opportunity to work on revolutionary systems that impact lives globally, emphasizing innovation and a pioneering spirit.

Responsibilities

  • Designing, modeling, and verifying RF/microwave and mixed signal assemblies and subsystems.
  • Utilizing analysis, simulations, and prototyping to develop antenna and signal conversion designs.
  • Deriving and trading requirements with components, assembly, and subsystem engineers.
  • Performing electromagnetic simulation of component, assembly, and subsystem level performance.
  • Managing RF budgets, frequency planning, and common assembly level interfaces.
  • Predicting assembly level performance through selecting materials, components, and packaging approaches.
  • Developing custom RF integrated circuit designs to meet assembly and subsystem level requirements.
  • Collaborating with peer functions such as Mechanical, Manufacturing, Quality, Supply Chain, and Test.
  • Utilizing world-class manufacturing capabilities for prototyping through full-rate production.
  • Working directly with external supplier partners including foundries and component manufacturers.
  • Supporting products throughout the product life cycle (EMD, production, sustainment, DMS).
  • Working with RF and mixed signal assembly product types including antenna radiators, circulators, and filters.

Requirements

  • Bachelor's degree in Electrical Engineering or related STEM field with 5 years of RF/microwave experience; or a Master's degree with 3 years of experience; or a PhD with relevant experience; additional experience may be considered in lieu of a degree.
  • US Citizenship is required.
  • Must have Full Secret Clearance prior to start.
  • Ability to provide sound solutions to complex RF/Microwave design and test problems.
  • Intermediate to expert proficiency with RF/Microwave modeling and simulation tools.

Nice-to-haves

  • Top Secret / SCI security clearance
  • Experience with RF and mixed signal printed circuit board designs
  • Knowledge of RF budgeting and frequency planning
  • Experience with integrated circuit packaging techniques
  • Familiarity with RF lab equipment such as network analyzers and spectrum analyzers
  • Experience in the Aerospace or Defense Industry

Benefits

  • Health insurance coverage
  • Life and disability insurance
  • Savings plan
  • Company paid holidays
  • Paid time off (PTO) for vacation and personal business
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