Oracle - Annapolis, MD
posted 2 months ago
As a Principal Thermal Engineer at Oracle, you will play a crucial role in aligning OCI thermal hardware design with the physical infrastructure of data centers. This position requires a blend of technical breadth and depth, enabling you to work cross-functionally with various disciplines, including Mechanical, Electrical, Thermal, and Software engineering. Your primary focus will be on developing thermal solutions that are optimized for the entire stack, ensuring the effective management of high-performance data center devices. You will collaborate with both internal and external partners to deliver next-generation hardware and data center solutions that meet the evolving needs of cloud computing. In this role, you will be responsible for building and conducting thermal simulations, reviewing models from partners to identify risks, and improving efficiency within data centers. You will design and conduct experiments to validate and produce accurate Computational Fluid Dynamics (CFD) models, comparing test results against platform telemetry and facility Building Management System (BMS) data. Engaging with leading CFD software companies will be essential to drive product roadmaps that align with OCI's requirements for high-density air and liquid cooling solutions. Your responsibilities will also include leading thermal design reviews, collaborating with multidisciplinary teams to develop Advanced Cooling Solution (ACS) prototypes, and working with hardware development organizations to drive concepts into the product roadmap. You will create robust thermal architecture solutions that consider current and anticipated industry needs, distilling architectural trade-offs in terms of feasibility, performance, cost, reliability, availability, and schedule. Additionally, you will partner with platform and data center architects to define OCI's roadmap and look for opportunities to generate intellectual property that strengthens OCI's position in cloud computing.