Oracle - Sacramento, CA
posted about 2 months ago
As a Principal Thermal Engineer, you will focus on the alignment of OCI thermal hardware design and the data center physical infrastructure. This role requires a mix of technical breadth and depth to work cross-functionally with various disciplines, including Mechanical, Electrical, Thermal, and Software engineering, to develop thermal solutions optimized for the entire stack. You will be responsible for effectively managing high-performance data center devices and collaborating with both internal and external partners to deliver the next generation of world-class hardware and data centers. Your primary responsibilities will include building and conducting thermal simulations, reviewing thermal simulation models from partners to identify data center risks, and improving efficiency. You will design and conduct experiments to validate and produce accurate Computational Fluid Dynamics (CFD) models by comparing test results against platform telemetry and facility Building Management System (BMS) data. Engaging with leading CFD software companies will be essential to drive their product roadmap to meet OCI's requirements for high-density air and liquid cooling solutions. In addition to these primary responsibilities, you will collaborate with global partners to develop platform hardware and data center infrastructure solutions that enable OCI services. Leading thermal design reviews and presenting concepts to peers, partner teams, and executives will be part of your role. You will work jointly with multidisciplinary teams, including both in-house and external partners, in the development of Advanced Cooling Solution (ACS) concept prototypes. Your collaboration with firmware and controls engineering teams will be crucial in creating robust thermal control and monitoring systems. You will also conduct design/debug investigations and support failure analysis and resolution activities for platforms and data center infrastructure, ensuring that all designs meet the required specifications.