R&D 3D DRAM Dry Etch Senior/Principal Process Development Engineer

Micron Technology - Boise, ID

Full-time - Senior

Boise, ID

Computer and Electronic Product Manufacturing

About the position

As a Senior/Principal Process Development Engineer at Micron Technology, you will be an integral part of a pioneering 3D DRAM research and development dry etch team. This position offers a unique opportunity to engage in innovative processes that will shape the future of memory and storage solutions. You will be responsible for leading the dry etch process development, which includes innovating and developing dry etch processes that meet both structural and electrical specifications. Your role will involve close collaboration with process integration teams to influence integration flows and specifications, ensuring that the processes align with the overall project goals. In this position, you will also lead multi-functional teams to address complex structural challenges, supporting root cause analysis and unique defect investigations. You will be expected to present process and technology roadmaps for current and future technology nodes, and interact with other process areas to identify and drive collaborative solutions. Your expertise will not only be a resource for your peers in dry etch technology but will also extend to mentoring and guiding other engineers in project management and technical aspects. The ideal candidate will thrive in a research and development environment, possessing a strong background in NVM parts integration and module ownership. You should have experience with both Inductively Coupled Plasma (ICP) and Capacitively Coupled Plasma (CCP) tools, as well as familiarity with 3D NAND Worldline access or contact modules. High aspect ratio etch experience is preferred, along with a solid understanding of statistical process control and analysis. Your knowledge of plasma physics and surface phenomena will be crucial in driving innovation and problem-solving within the team.

Responsibilities

• Leading Dry etch process development
• Developing and innovating dry etch processes to meet structural and electrical specifications
• Collaborating with process integration teams to influence integration flow or specifications
• Leading multi-functional teams to tackle sophisticated structural problems
• Supporting root cause and unique defect analysis
• Presenting process and technology roadmaps for current and future technology nodes
• Identifying and driving towards collaborative solutions with other areas
• Mentoring peers in dry etch technology and project management
• Providing critical updates to upper management on project status and impacts

Requirements

• MS / PhD with 3-10 years of relevant experience
• BS + 5-10 years of relevant experience
• Experience in NVM parts integration/module ownership
• Experience with both ICP and CCP tools
• Experience in 3D NAND Worldline access or contact module
• High aspect ratio etch experience (preferred)
• Experience in running technical projects or leading groups of other engineers
• Understanding of statistical process control and analysis
• Knowledge of different types of dry etch reactors (e.g., RF sources, chemistries)
• Knowledge of plasma physics, transport or surface phenomena gained through experience or coursework
• Proven leadership in problem-solving
• Strong digital literacy, including MS Office

Nice-to-haves

• Experience in high aspect ratio etch processes
• Familiarity with advanced semiconductor manufacturing techniques

Benefits

• Choice of medical, dental, and vision plans
• Income protection programs for illness or injury
• Paid family leave
• Robust paid time-off program
• Paid holidays