R&D Integration Engineer

Broadcom - Fort Collins, CO

Full-time - Mid Level

Fort Collins, CO

Computer and Electronic Product Manufacturing

About the position

The Integration Engineer role at Broadcom's Wireless Semiconductor Division focuses on developing new MEMS micro fabrication technologies, specifically FBAR piezoelectric MEMs process technologies. This position involves project management of technology development activities, hands-on experimental work, and collaboration with cross-functional teams to ensure successful high-volume manufacturing readiness.

Responsibilities

• Hands-on visual, mechanical, and electrical evaluation of wafers.
• Validation of material to R&D specifications and manufacturing standards using metrology and physical analysis.
• Develop and execute Design of Experiments (DOEs).
• Develop and verify root-cause models and solutions.
• Lead technology development from concept to high-volume manufacturing readiness.
• Research and evaluate new capabilities from vendors and drive the tool selection process.
• Create functional MEMS process flows while balancing quality, cost, and time.
• View, understand, and create layout artwork.
• Apply understanding of device physics and RF technology to propose new processes and devices.
• Monitor technology developments in academia and industry.

Requirements

• MS in EE, ME, Materials Science, or related discipline with a minimum of 6+ years of experience in semiconductor/MEMs processing or equivalent, or PhD in the same fields with a minimum of 3+ years of experience.
• Industrial experience as an integration or development engineer with hands-on expertise required.
• Experience taking a device idea from initial process conception through high volume production release preferred.
• First-hand experience and expertise with at least one unit process area such as film deposition, photolithography, etching, wafer bonding, or wet processing.
• First-hand experience and expertise with BEOL processing steps such as metallization, plating, RDL, vias, Cu pillars, wafer bonding.
• Comfortable spending time in the cleanroom and physical analysis lab designing, executing, and evaluating experiments.
• Knowledge of and practical experience in statistical analysis and SPC methodology.
• Knowledge of semiconductor processing equipment and vendor roadmaps, with experience working with vendors to deliver necessary process capabilities.
• Experience designing and implementing novel MEMS components such as microresonators, pressure sensors, or accelerometers preferred.
• RF, FBAR, or BAW experience preferred.

Nice-to-haves

• Experience with statistical process control (SPC) methodology.
• Experience in leading cross-functional teams in a manufacturing environment.

Benefits

• Competitive salary and performance bonuses.
• Health insurance coverage.
• 401(k) retirement plan with company matching contributions.
• Paid time off and holidays.
• Professional development opportunities.