R&D Integration Engineer

Broadcom - Fort Collins, CO

Full-time

Fort Collins, CO

Computer and Electronic Product Manufacturing

About the position

We are looking to hire a talented, highly motivated integration engineer to develop new MEMS micro fabrication technologies. As an Integration Engineer with Broadcom's Wireless Semiconductor Division (WSD), you will develop new FBAR (Film Bulk Acoustic Resonator) piezoelectric MEMs process technologies to support the wireless filter business. You will join our process development engineering team and work alongside other manufacturing and development engineers to develop and release new technologies for high volume manufacturing. The role will involve project management of new technology development activities including scoping, technical work, on-time delivery, and formal presentations. The role may also involve hands-on experimental work in the cleanroom and characterization labs (25-75%). You will be expected to understand key FBAR electrical and physical parameters and utilize CAD software such as Cadence and ADS to extend FBAR value propositions for next generation products. The successful candidate will be expected to function in our highly-collaborative and team-oriented environment including cross-functional groups on site and international teams.

Responsibilities

• Hands-on visual, mechanical, and electrical evaluation of wafers.
• Validation of material to R&D specifications and manufacturing standards using metrology and physical analysis.
• Develop and execute DOEs. Develop and verify root-cause models and solutions.
• Lead technology development from concept to high-volume manufacturing readiness.
• Research and evaluate new capabilities from vendors and drive the tool selection process.
• Create functional MEMS process flows while balancing competing engineering concerns such as quality, cost, and time.
• View, understand, and create layout artwork.
• Apply understanding of device physics and radio frequency (RF) technology to propose new processes and devices.
• Monitor technology developments in academia and industry.

Requirements

• MS in EE, ME, Materials science, or related discipline with a minimum of 6+ years of experience in semiconductor/MEMs processing or equivalent or PhD in EE, ME, Materials science, or related discipline with a minimum of 3+ years of experience in semiconductor/MEMs processing or equivalent.
• Industrial experience as an integration or development engineer with hands-on expertise required. Candidates with significant university cleanroom experience may be considered.
• Experience taking a device idea from initial process conception through high volume production release preferred.
• First-hand experience and expertise with at least one unit process area such as film deposition, photo, etch, wafer bond, wet processing, etc.
• First-hand experience and expertise with BEOL processing steps such as metallization, plating, RDL, vias, Cu pillars, wafer bonding.
• Comfortable spending time in the cleanroom and physical analysis lab designing, executing, and evaluating experiments.
• Knowledge of and practical experience in statistical analysis and SPC methodology.
• Knowledge of semiconductor processing equipment, vendor roadmaps, and previous experience in working with vendors to deliver necessary process capabilities.
• Experience designing and implementing novel MEMS components such as microresonators, pressure sensors, accelerometers, or other piezoelectric devices preferred.
• RF, FBAR, or BAW experience preferred.

Nice-to-haves

• Experience with statistical process control (SPC) methodology.
• Familiarity with RF technology and its applications in MEMS devices.