The position involves managing side processes for current and future MMIC products, focusing on the heterogeneous integration of high frequency components. Key responsibilities include MMIC wafer thinning, wafer separation, dicing, chip sort, visual inspection, and outgoing quality. The role is critical to Keysight's high frequency packaging roadmap and requires ownership of Die Fab processes and equipment to support both production sustaining and R&D activities.
Stand Out From the Crowd
Upload your resume and get instant feedback on how well it matches this job.
Career Level
Mid Level
Industry
Computer and Electronic Product Manufacturing
Education Level
Bachelor's degree