Semiconductor Process Development Engineer - Die Fab Operation

About the position

The position involves managing side processes for current and future MMIC products, focusing on the heterogeneous integration of high frequency components. Key responsibilities include MMIC wafer thinning, wafer separation, dicing, chip sort, visual inspection, and outgoing quality. The role is critical to Keysight's high frequency packaging roadmap and requires ownership of Die Fab processes and equipment to support both production sustaining and R&D activities.

Responsibilities

• Driving heterogeneous integration development projects that are critical to Keysight's high frequency packaging roadmap
• Ownership of Die Fab processes and equipment to drive production sustaining and R&D activities
• Work closely with other process, integration, product, and circuit design engineers to define process and device performance targets
• Define process flows, develop new fabrication processes and drive continuous process improvement (CPI) efforts to maximize product yield
• Ensure successful transfer and maintenance of new technologies in manufacturing, encompassing performance, reliability, and manufacturing goals
• Work with Operations Group to implement robust process control; diagnose and resolve process problems
• Lead capital equipment acquisition projects that include tool evaluation, characterization, process development, and qualification.

Requirements

• B.S. or M.S. in Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, Physics, or equivalent experience
• 3 years of experience in advanced semiconductor processes and devices is required
• Experience with statistical process control and design of experiments is required
• Strong problem-solving and analytical skills
• Excellent interpersonal and communication skills for successful inter and intra-group interactions
• Strong self-initiative and proactive attitude

Nice-to-haves

• Previous experience in heterogeneous integration and advanced packaging & assembly techniques
• Experience in MMIC wafer thinning and Die Fab operations such as laser separation, saw separation, chip sort, auto-visual, and other backend processes
• Specific skills in III-V semiconductor processing are highly preferred.