Senior Engineer I - Manufacturing

About the position

We are looking for a Senior Engineer I - Manufacturing who enjoys working within a team environment at our Lowell, MA site. In this role, you will actively contribute to the engineering efforts required for the manufacturing, process development and NPI of semiconductor devices and assemblies. Role functions will include the support of process development, manufacturing, materials analysis & definition, production analysis, and process advancement. This role is a hands-on process development role of chip and wire assembles for semiconductor and MMICs packages and assemblies. The position supports existing manufacturing processes with extensive support of NPI prototypes.

Responsibilities

• Work as an interface between Operations and Engineering to create and improve assembly processes.
• Actively own engineering responsibilities for assigned product groupings.
• Drive & lead engineering efforts for NPI process development and qualification.
• Perform in-depth studies where opportunities exist for improvement to processes.
• Understand MIL-PRF-19500, MIL-PRF-38534, IPC600 and all industry standards used in semiconductor assembly environment.
• Create and improve process documentation and support manufacturing training.

Requirements

• B.S. in Mechanical, or other related engineering disciplines.
• Minimum of 6 years manufacturing engineering experience.
• Experience in Semiconductor die attach and wire bonding processes.
• Familiarity with statistical methods such as SPC, Gage R&R, DOE, 5 Why’s, 6 Sigma, etc.
• Strong Microsoft Office skills with high proficiency in Excel.
• Must be well organized with an ability to multitask, work on a diverse set of problems while simultaneously being on a steep learning curve.
• Practical verbal and written communication skills (English) can clearly present and discuss manufacturing information to technical and non-technical team members.

Nice-to-haves

• Chip and wire assembly experience within a semiconductor manufacturing environment.
• Experience with Au/Sn, Au/Ge and SAC305 solders, gold wire bonding, Ag sinters, various epoxies, and encapsulation materials.
• Experience in the handling, inspection, and assembly on MMIC devices.
• Experience with MIL-PRF-19500 & / or MIL-PRF-38534 product manufacture.
• Experience in PCB assembly per IPC600.