Nvidia
posted 25 days ago
NVIDIA is seeking a Senior Packaging Technical Engineer to join our innovative team. In this role, you will be responsible for defining the chip pad ring, substrate interconnect scheme, and leading the package layout design process. You will collaborate with large teams that include Circuit, Signal Integrity, RTL, Place and Route, substrate layout, and system design engineers and managers. Your work will involve defining a chip floor plan, pad ring, substrate, and ball out, all while implementing a robust, world-class electrical package. Effective communication with various teams throughout the company is essential to ensure the success of the projects you will be involved in. As a Senior Packaging Technical Engineer, you will play a crucial role in the development of cutting-edge GPU and AI technology. Your expertise will contribute to solving complex technical problems and driving the evolution of our products. NVIDIA is committed to fostering a diverse work environment, and we are proud to be an equal opportunity employer. We value diversity in our current and future employees and do not discriminate based on any characteristic protected by law. Join us in amplifying human imagination and intelligence through technology.