Senior/Principal Electronics Engineer - ASICS Design Engineer, Onsite

About the position

Organization 05212, HI Sensor uSystems & FA, is seeking an experienced R&D Electronics Engineer/ASIC Design Engineer to join our team that develops sophisticated heterogeneously integrated sensor microsystems. The selected candidate will be asked to develop, architect, design, and lead high complexity electronic microsystems (typically integrated circuits) that support Sandia's national security mission. These microsystems include focal-plane arrays as well as other multi-component microsystems enabled by heterogeneous integration.

Responsibilities

• Design, evaluate, and test integrated circuits for sensor microsystems.
• Translate customer requirements into high level system architectures.
• Apply a broad understanding of a variety of microsystems technologies (CMOS, MEMS, photonics, III-V semiconductors, etc.) and heterogeneous integration technologies to drive development of highly optimized, heterogeneously integrated microsystems.
• Develop and contribute to research thrusts in novel signal/data processing circuit design techniques relevant to focal-plane arrays (e.g. neuromorphic circuit architectures, etc.) and radiation detectors.
• Develop and contribute to research thrusts in microsystem integration, particularly heterogeneous integration technologies required to realize focal-plane arrays and other high complexity microsystems.

Requirements

• Ph.D. in a relevant STEM field or; Master's degree in a relevant STEM field plus four (4) years' experience or; equivalent combination of relevant education and experience (BS + 8 years)
• Experience with analog integrated circuit design, simulation/verification, and layout, particularly in Cadence tools
• Ability to acquire and maintain a DOE Q clearance

Nice-to-haves

• Experience with analog sensor frontends
• Proficiency in requirements and design of radiation-hardened circuits, low power systems, or deployed sensors
• Experience with designing CMOS devices, embedded systems, FPGAs, or microcontrollers
• Experience with microsystem integration schemes (e.g. bump bonding)
• Experience with testing, diagnosing, and debugging integrated circuits
• Familiarity with some of the following: VHDL or Verilog languages, Python or Perl, PCB electronics design and layout
• Ability to innovate, preferably as shown through patents and/or publications
• Strong interpersonal skills which include teamwork, effective leadership, compromise, delegation, conflict resolution, and the ability to work in a diverse team
• Excellent oral and written communication skills, including the development and delivery of presentations, proposals, reports, and documentation

Benefits

• Generous vacation
• Strong medical and other benefits
• Competitive 401k
• Learning opportunities
• Relocation assistance
• Amenities aimed at creating a solid work/life balance