Oracle - Columbia, SC
posted 2 months ago
As a Senior Principal Thermal Engineer, you will focus on the alignment of OCI thermal hardware design and the data center physical infrastructure. This role requires a mix of technical breadth and depth to work cross-functionally with different disciplines, including Mechanical, Electrical, Thermal, and Software engineering, to develop thermal solutions optimized for the entire stack. You will be responsible for effectively managing high-performance data centers and collaborating with both internal and external partners to deliver the next generation of world-class hardware and data centers. Your primary responsibilities will include collaborating with OCI engineering teams to develop and implement new Computational Fluid Dynamics (CFD) technologies and methodologies aimed at improving the performance and efficiency of OCI platforms and data center infrastructure. As a technical lead, you will serve as a resident expert in data center mechanical systems and thermal management. You will apply engineering cooling methodologies to craft solutions for both small and large-scale data center designs, utilizing CFD and flow network modeling tools to generate digital twin models from chip to external heat rejection solutions. In addition to technical responsibilities, you will design and conduct experiments to validate CFD models by comparing test results with platform telemetry and facility Building Management System (BMS) data. You will also engage with leading CFD software companies to influence their product roadmaps to meet OCI's requirements for high-density air and liquid cooling solutions. Your role will involve leading thermal design reviews and presenting concepts to peers, partner teams, and executives, as well as collaborating with multidisciplinary teams to develop Advanced Cooling Solution (ACS) prototypes. You will be expected to create robust, scalable, secure, and extensible thermal architecture solutions that account for current and anticipated industry needs, while also distilling architectural tradeoffs in terms of feasibility, performance, cost, reliability, availability, and schedule.