Raytheon Technologies - Orlando, FL

posted 3 months ago

Full-time - Senior
Orlando, FL
Computer and Electronic Product Manufacturing

About the position

At Raytheon, the foundation of everything we do is rooted in our values and a higher calling - to help our nation and allies defend freedoms and deter aggression. We bring the strength of more than 100 years of experience and renowned engineering expertise to meet the needs of today's mission and stay ahead of tomorrow's threat. Our team solves tough, meaningful problems that create a safer, more secure world. The RF Mechanical Team at Raytheon is seeking a talented Senior Engineer to join our team in Tucson, AZ. The candidate will be responsible for providing innovative design solutions for the packaging of antennas, RF Circuit Card Assemblies, radomes, and RF test equipment. The selected candidate will be expected to lead diverse multidiscipline teams, provide technical oversight, delegate tasks, and work with the Engineering organization to establish technology roadmaps, enable modernization, and contribute to general innovation. In addition, the candidate will work with customer personnel and program leadership to define and refine requirements to validate hardware compliance. The candidate will be responsible for providing guidance, coaching, mentoring, and training to other employees across the business within the candidate's areas of expertise. This position is an onsite role, located in Tucson, AZ.

Responsibilities

  • Provide innovative design solutions for the packaging of antennas, RF Circuit Card Assemblies, radomes, and RF test equipment.
  • Lead diverse multidiscipline teams and provide technical oversight.
  • Delegate tasks and work with the Engineering organization to establish technology roadmaps.
  • Enable modernization and contribute to general innovation.
  • Work with customer personnel and program leadership to define and refine requirements to validate hardware compliance.
  • Provide guidance, coaching, mentoring, and training to other employees.

Requirements

  • Typically requires a Bachelor's in Science, Technology, Engineering, or Mathematics (STEM) and a minimum of 5 years of prior relevant experience, or an Advanced Degree in a related field and minimum 3 years of experience.
  • Experience in performing design and analysis for the packaging of RF products throughout the product life cycle.
  • Proficiency in three-dimensional (3D) Computer Aided Design (CAD) software.
  • Creation of Technical Data Packages (TDPs) using Geometric Dimensioning and Tolerancing (GD&T) for RF products.
  • Ability to obtain and maintain a U.S. government issued security clearance.

Nice-to-haves

  • Master of Science (MS) in mechanical engineering or electrical engineering.
  • Experience serving as a Responsible Engineering Authority (REA), Control Account Manager (CAM), and/or Integrated Product Team Lead (IPTL).
  • Supplier management for built to print or build to specification RF products.
  • Experience creating and presenting professional level design documentation to company leadership and program customers.
  • Familiarity with Creo Simulate or ANSYS Workbench for preliminary structural and thermal analysis of design concepts.
  • Excellent written and verbal communication skills.
  • Experience in failure investigation, root cause identification, and corrective action implementation.
  • Familiarity with RF Printed Circuit Board (PCB) material stack ups and Circuit Card Assembly (CCA) layout.

Benefits

  • Medical, dental, vision, life insurance, short-term disability, long-term disability.
  • 401(k) match.
  • Flexible spending accounts.
  • Flexible work schedules.
  • Employee assistance program.
  • Employee Scholar Program.
  • Parental leave.
  • Paid time off and holidays.
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