SiliconOne Mechanical Packaging Engineer
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About The Position
Cisco Silicon One is a business organization building and selling ASICs inside and outside of Cisco. We have a long track record of building large, high-performance Silicon ASICs for Cisco's internal platforms and external customers. We are a specialized ASIC team with experts in all aspects of Silicon Design and system integration. Our substrates are using the latest fanout technologies for large scale integration. We are focused on all the latest technologies including optical and advanced packaging. Cisco SiliconOne ASIC team is looking for an expert in advanced silicon substrate mechanical analysis to help us develop our next generation silicon and platforms. You will have advanced experience with co-simulation of silicon ASIC, interposer technologies, package substrate and PCB. You will be involved in substrate material development and SMT attach strategies and involved in multiple aspects of substrate planning and layout to make new silicon products successful. You will develop advanced packages utilizing new fanout technologies using new materials. You will lead thermal-mechanical analysis for preferred package and board attach and explore optimizations. You will extend a track record of leading similar products to first pass success by minimizing package design iterations.
