Sr. Photonics Integration Engineer

Harvard University - Cambridge, MA

Full-time - Mid Level

Cambridge, MA

Educational Services

About the position

The Sr. Photonics Integration Engineer at Harvard University is a pivotal role within the Center for Nanoscale Systems, focusing on the operation and maintenance of advanced quantum/photonics and electronics packaging systems. This position requires overseeing a diverse range of state-of-the-art equipment, including 3D Photonic Wire Bonder, 3D laser printing, advanced flip-chip bonder, wafer bonder, wire bonder, dicing saw, cleaver, and 2D material assembly. The engineer will lead the integration and packaging process design and development for advanced quantum/photonics device assembly, which includes user training, authoring standard operating procedures (SOPs), tool performance improvement, and establishing a packaging process database. In addition to these responsibilities, the engineer will participate in user research projects aimed at evaluating, designing, expanding, and maintaining equipment capabilities and process recipes. This role also involves engaging with other staff on nanofabrication process development and integration, such as lithography, Reactive Ion etching (RIE), film deposition, wet etching, and metrology. The engineer will be responsible for bringing new fabrication and packaging technologies to the Center for Nanoscale Systems, interfacing with vendors and users to evaluate, acquire, and commission state-of-the-art equipment to meet current and future research needs. As a member of the Emergency Response Team (ERT), the engineer will train users on best safety practices and help monitor laboratory safety compliance. This position is not only technical but also emphasizes a commitment to equity, diversity, inclusion, and belonging, fostering a culture where everyone can thrive. The ideal candidate will be self-motivated, possess excellent problem-solving skills, and have a strong desire to develop both intellectual and practical professional skills.

Responsibilities

• Oversee the operation and maintenance of quantum/photonics and electronics packaging systems.
• Lead integration/packaging process design and development for advanced quantum/photonics device assembly.
• Conduct user training and author standard operating procedures (SOPs).
• Establish and maintain a packaging process database.
• Assist users with project troubleshooting and support.
• Participate in user research projects to evaluate and maintain equipment capabilities and process recipes.
• Engage in nanofabrication process development and integration, including lithography and etching.
• Bring new fabrication and packaging technologies to the Center for Nanoscale Systems.
• Interface with vendors and users to evaluate and acquire new equipment.
• Train users on safety practices and monitor laboratory safety compliance.

Requirements

• Bachelor's degree in a scientific or engineering discipline and at least five years of relevant work experience; OR a minimum of nine years of relevant work experience or equivalent combination of education and experience.
• Graduate degree in Electrical Engineering, Physics, Chemical Engineering, Material Science, Chemistry or a related field with 3-5 years experience is desirable.
• Extensive experience with back-end and photolithography technology is required.
• Cleanroom fabrication experience, especially in photolithography, etching, film deposition, and metrology, is highly desirable.
• Demonstrated ability to work well in a team environment.
• Excellent communication skills in English, both written and oral.
• Ability to perform highly complex experiments with high levels of reliability and accuracy within time constraints.
• Must possess excellent problem-solving skills.

Nice-to-haves

• Intermediate Excel skills.
• Experience with pattern design software.

Benefits

• 3-4 weeks of accrued vacation time per year (3 weeks for support staff and 4 weeks for administrative/professional staff).
• 12 accrued sick days per year.
• 12.5 holidays plus a Winter Recess in December/January.
• 3 personal days per year (prorated based on date of hire).
• Up to 12 weeks of paid leave for new parents who are primary caregivers.
• Comprehensive medical, dental, and vision benefits.
• Disability and life insurance programs.
• Child and elder/adult care resources including on-campus childcare centers.
• Employee Assistance Program and wellness programs related to stress management, nutrition, and meditation.
• University-funded retirement plan with contributions from 5% to 15% of eligible compensation.
• Tuition Assistance Program including $40 per class at the Harvard Extension School.
• Tuition Reimbursement Program providing 75% to 90% reimbursement up to $5,250 per calendar year for eligible courses.
• Professional Development programs and classes at little or no cost.
• Various commuter options including discounted parking and public transportation passes.
• Access to Harvard athletic and fitness facilities, libraries, campus events, and discounts to various services.