Sr. Signal and Power Integrity Engineer

$117,200 - $229,200/Yr

Microsoft - Raleigh, NC

Full-time - Senior

Remote - Raleigh, NC

Publishing Industries

About the position

The Senior Signal and Power Integrity Engineer will be part of the Azure hardware engineering team, focusing on developing advanced power delivery and signaling solutions for High Performance Computing (HPC) silicon designs. This role involves driving the completion of Signal Integrity and Power Integrity (SIPI) design solutions that support overall System on Chip (SoC) performance, collaborating with silicon, packaging, and system design teams to ensure optimal performance and efficiency in cutting-edge hardware designs.

Responsibilities

• Implement strategies for end-to-end power delivery design and signal integrity design from Silicon to Package, linking to Platform to System and Cloud.
• Deliver SIPI solutions that meet the HPC demand across the entire system.
• Drive future power and signal integrity solutions for chiplet architecture with advanced packaging and advanced silicon nodes.
• Design, model, and simulate Signal Integrity (SI) and Power Integrity (PI) solutions for data center processors and corresponding platforms to ensure optimized performance.
• Perform DC, AC, and transient simulations to provide noise and impedance profiles of the whole power delivery path and validate I/O performance from platform to silicon.
• Work closely with silicon and platform architects, motherboard and package designers, thermal architects and engineers, and power and performance engineers.
• Drive the execution of architecture solutions across product lines or multiple product groups, leveraging cross-functional expertise and industry best practices.
• Drive engineering system design decisions that require collaboration between internal and external stakeholders.

Requirements

• 7+ years of related technical engineering experience or a Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or related field with 4+ years of technical engineering experience.
• 5+ years of experience in silicon/package/system signal integrity and power delivery.
• Working knowledge in the field of end-to-end system SIPI Design and Architecture.
• Industry knowledge, trends, and landscape of technologies to drive development across Silicon-IP, Advanced packaging, Substrate technology, Board technology, and Platform design.

Nice-to-haves

• 11+ years of technical engineering experience or a Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or related field with 8+ years of technical engineering experience.
• 10+ years of experience in silicon packaging product development with high-speed signal design and/or power integrity modeling for HPC products.
• Strong foundation in advanced packaging technologies as they relate to Signal and Power integrity.

Benefits

• Industry leading healthcare
• Educational resources
• Discount on products and services
• Savings and investment options
• Maternity and paternity leave
• Generous time away
• Giving program
• Opportunities to network and connect