Technical Director, Advanced Packaging

About the position

The Technical Director for Advanced Packaging at Lam Research will play a pivotal role in the Global Customer Operations Group, focusing on the regional advanced packaging market. This position involves technical marketing support, local field capability development, and external ecosystem engagement to enhance the company's market share and brand presence in advanced packaging technology.

Responsibilities

• Map customer market & technical roadmap, trends, challenges, requirements & inflection points.
• Partner with local account teams in application matrix building & key penetration and defense identification.
• Provide technical marketing support to the Sales organization by positioning the company's product and technical value.
• Coordinate total packaging solution TRMs in customer sites.
• Support market requirement surveys for packaging products and conduct business and competitive intelligence.
• Conduct field process and sales team training on packaging trends and products.
• Manage integrated demos to ensure on-time delivery and meeting customer requirements.
• Serve as a technical advisor/leader in high impact customer escalations related to P&D and integration.
• Participate in local packaging conferences to increase network & awareness, potentially as a guest speaker to promote Lam solutions.
• Engage with fabless and local research institutes to understand and influence the packaging roadmap.

Requirements

• Engineering master or equivalent degree.
• More than 15 years of relevant experience in the semiconductor industry, preferably in 3D advanced packaging integration.
• Strong technical knowledge and hands-on experience with packaging tools and applications.
• Prior marketing experience is an added advantage.
• Ability to work independently and make decisions within the assigned area of responsibility.
• Strong inter-personal and communication skills, with proficiency in oral and written English and Mandarin.
• Good analytical and problem-solving skills.
• Strong customer management and project management skills.
• Ability to work as a team player in a matrix organization with internal and external stakeholders.
• Willingness to travel within the region and occasionally internationally.

Nice-to-haves

• Experience in technical marketing within the semiconductor industry.
• Familiarity with local packaging conferences and networking opportunities.

Benefits

• Comprehensive set of outstanding benefits for employees.
• Flexible work location models including On-site Flex and Virtual Flex.