Thermal, Mechanical or Electrical modeling Engineer for 3D Heterogeneous Integration Applications

$85,900 - $158,600/Yr

GlobalFoundries - Malta, NY

Full-time

Malta, NY

Computer and Electronic Product Manufacturing

About the position

GlobalFoundries is a leading full-service semiconductor foundry that provides a unique combination of design, development, and fabrication services to some of the world's most innovative technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries enables the technologies and systems that transform industries and empower customers to shape their markets. The company is currently seeking an experienced Thermal, Mechanical, or Electrical Modeling Engineer to address 3D Heterogeneous Integration (3DHI) and advanced packaging challenges across a wide range of logic, RF, analog, and memory technologies. This role will focus on utilizing commercial modeling tools to guide device integration and optimize 3DHI advanced packaging for mechanical, thermal, or electrical performance. The successful candidate will be responsible for performing stress simulations for both continuous and discontinuous active areas, analyzing how stress impacts device performance, particularly in mechanical modeling. They will anticipate integration and process issues based on information provided by integration, process, or design enablement teams and will perform necessary modeling to facilitate discussions with originating teams. This collaboration will help identify simulations that highlight critical process interactions and drive optimal decisions regarding 3DHI technology. The engineer will apply commercial simulation software to mimic semiconductor process flows and pinpoint areas of concern, ensuring extensive interaction with integration, device, and design engineers to develop effective technology solutions. In addition to technical responsibilities, the engineer will be expected to perform all activities in a safe and responsible manner, supporting all Environmental, Health, Safety & Security requirements and programs. Other duties may be assigned by the manager as needed.

Responsibilities

• Utilize commercial software for mechanical, thermal, or electrical modeling.
• Conduct stress simulations for continuous and discontinuous active areas, analyzing the impact on device performance.
• Anticipate integration and process issues based on information from integration, process, or design enablement teams.
• Facilitate discussions with originating teams to identify critical simulations and drive optimal 3DHI technology decisions.
• Apply commercial simulation software to mimic semiconductor process flows and highlight areas of concern.
• Engage extensively with integration, device, and design engineers to ensure the development of effective technology.

Requirements

• M.S. degree with a minimum of 5 years of relevant experience or PhD with a minimum of 3 years of relevant experience.
• Experience with semiconductor mechanical, thermal, or electrical simulation tools such as Ansys Mechanical Workbench or similar software.
• Solid understanding of semiconductor processes and integration techniques.
• Strong computer and software skills.
• Ability to clearly present results to both small and large groups.

Nice-to-haves

• PhD with 5 years of relevant experience.
• Experience in thermal and electrical simulation for specific IC circuit designs, preferably RF analog.
• Familiarity with LVS and DRC verification tools such as Cadence, Mentor Graphics, or Keysight ADS.
• Demonstrated work performance in environments requiring high attention to detail and timeliness.