Thermal/Mechanical System Architect

Asus Computer International - Hillsboro, OR

Full-time - Senior

Hillsboro, OR

501-1,000 employees

Wholesale Trade Agents and Brokers

About the position

The Thermal / Mechanical System Architect at ASUS Computer International is a senior leadership role responsible for the system-level thermal and mechanical design of NUC products. This position involves defining and resolving system-level challenges from early concepts to final production, focusing on innovative product development and rapid prototyping.

Responsibilities

• Lead the system-level and component-level thermal and mechanical conceptual design across various small form factor systems.
• Define system architecture for new products, balancing performance, acoustics, cost, and schedule requirements.
• Create 3D models and renderings to support expected system performance and aesthetics.
• Solve challenging thermal scenarios in high-density systems to drive innovations.
• Design and run thermal and heat-flow simulations using industry-leading tools.
• Create, fabricate, and validate system mock-ups and prototypes for advanced planning.
• Review and refine ODM/supplier thermomechanical design proposals.
• Validate physical designs and components through hands-on testing.
• Implement and validate platform thermal management systems.
• Tune the final thermal and power management subsystem for optimal performance and acoustics.
• Drive resolution of thermomechanical-related issues throughout the product life cycle.

Requirements

• Bachelor's degree in mechanical engineering or equivalent.
• 5+ years of thermal and/or mechanical engineering experience in the computer industry.
• 5+ years of experience working with PC ODMs and/or technology suppliers.
• Demonstrated understanding of advanced thermomechanical architecture related to PC or server system design.
• Working knowledge of industry-standard thermomechanical development tools.
• Experience with complex troubleshooting and system debug skills.

Nice-to-haves

• Experience developing Mini PC (sub 3L) Systems for commercial and consumer applications.
• Familiarity with Intel Turbo Boost Technology and its implementation.
• Understanding of thermal ergonomics and safety regulations.
• Knowledge of system-level design and manufacturing processes.
• Experience leading next generation product or technology planning.